The 2026 China Electronic Copper Foil Industry Summit Forum is scheduled to be held in Wuhan, Hubei Province from May 28 to 30, 2026.

 

The electronic copper foil industry will continue its recovery momentum in 2026, with sufficient orders and steadily rising processing fees. The driving factors are as follows: the comprehensive acceleration of AI computing power construction has fueled an explosive growth in demand for high-end copper foils such as HVLP for smart terminals; the continuous expansion of demand in the new energy sector, coupled with the impact of recent geopolitical conflicts on the global energy system, has presented a critical development window for electronic copper foil as a key basic material.

 

Nevertheless, the industry is confronted with a structural overcapacity crisis — oversupply of low-end capacity and shortage of high-end capacity. The dividends of scale expansion are fading away, ushering in an era where technological innovation determines market competitiveness. Faced with historic opportunities, the 2026 China Electronic Copper Foil Industry Summit Forum will take place in Wuhan, a transportation hub known as the "Thoroughfare to Nine Provinces". Centered on the theme "Resolving Structural Overcapacity Crisis, Realizing Independent Governance and Value Co-creation", the forum aims to jointly explore new development directions and drive the industry’s transformation from low-end capacity expansion to a new ecosystem of value co-creation.

 

During the forum, we will showcase a lineup of newly developed innovative products. With superior performance and unique application advantages, these products meet the stringent standards of the market, detailed as follows:

 

PCU-S80: Mercapto silane oligomer is a type of oligomeric organosilicon compound containing reactive mercapto groups (-SH) and hydrolyzable siloxane structures. Compared with monomeric silane, it features more uniform film formation, higher stability, greater functionality and better reactivity. Thanks to its unique chemical structure, it is widely applied in surface treatment, coatings, environmental protection and other fields. It can inhibit metal oxidation, corrosion and discoloration; improve the adhesion, weather resistance, wear resistance and anti-corrosion performance of coatings; and immobilize heavy metal ions in soil to prevent their migration and diffusion.

 

PCU-T: A methyl benzotriazole derivative soluble in aqueous systems, it serves as an efficient non-ferrous metal protective agent with excellent corrosion inhibition performance especially for copper. Compared with methyl benzotriazole, PCU-T can disperse evenly in the film layer without causing surface defects such as oil spots and craters, and it does not compromise the adhesion or gloss of the coating film. It has been effectively applied in water-based copper-gold paste coatings and metal pipeline water treatment.

 

PCU-1105: It is a high-end eco-friendly passivation agent for metals. Compared with conventional passivation agents, it boasts outstanding corrosion resistance, high heat resistance, excellent chemical resistance, low VOC content and high bonding strength, and contains no toxic substances such as chromium and cadmium. It delivers high reactivity and maintains superior performance even at a low curing temperature of 80°C. Tests show that copper foil treated with 5% PCU-1105 remains discoloration-free after being heated at 170°C for 10 minutes.

 

Our company is committed to improving product quality and customer experience through technological innovation. We aim to meet the growing demands of the electronic copper foil industry via continuous new product R&D, while providing high-quality services and support for customers.

 

We look forward to meeting you in Wuhan to discuss the future development of the electronic copper foil industry. Please stay tuned to our official website for more details on new products and latest market updates.

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