China's electronic copper foil industry is in a critical period of transformation and upgrading. With the rapid development of emerging industries such as 5G communications, new energy vehicles and artificial intelligence, the demand for high-end electronic copper foil featuring high-frequency & high-speed performance, ultra-thin thickness and high strength keeps growing. Against this backdrop, the 16th China Electronic Copper Foil Technology Seminar will be held at the InterContinental Hotel of Shenzhen World Exhibition & Convention Center from November 19 to 21, 2025, with the theme of "Collaboration · Breakthrough · Leadership – Co-building a New Ecosystem for the Copper Foil Industry".   Wuhan Hugarise New Material Co.,Ltd. will participate in this grand event as a sponsoring organization. As a global highland for electronic manufacturing, Shenzhen and the Greater Bay Area gather a large number of terminal giants as well as leading enterprises in industries such as copper clad laminates (CCL), printed circuit boards (PCB) and batteries, forming one of the most complete electronic information industry chains worldwide. This seminar will provide a platform for in-depth docking between copper foil manufacturers and downstream application sectors, promoting the close integration of technological innovation and market application.   During the seminar, our company will showcase its latest technological achievements and innovative products, including:   Innovations in Electroplating Chemicals   H1: Enhances the corrosion resistance of copper foil; this high-purity product prevents edge tearing. ZPS: Serves as a brightener for acid copper plating. When used in combination with polyethers and wetting agents, it yields bright and highly ductile plating layers. SM110: Refines crystal grains, improves the leveling property and hardness of plating layers, and significantly boosts the tensile strength of copper foil. SN110: Refines crystal grains, improves the leveling property and hardness of plating layers, and significantly boosts the tensile strength of copper foil.   Innovations in Anti-oxidation Series   PCU-T (Methylbenzotriazole Derivative): Soluble in aqueous systems, it is an effective corrosion inhibitor for non-ferrous metals, especially for copper. It can replace benzotriazole and methylbenzotriazole. PCU-B (Benzotriazole Silane Oligomer): Mainly applied in metal surface treatment and anti-corrosion fields. As a corrosion inhibitor, it improves the oxidation resistance of materials; as a silane coupling agent, it enhances the adhesion performance of materials and provides long-lasting rust and corrosion protection. PCU-A18 (Vinyl Silane Oligomer): Mainly used as an anti-corrosion coating and adhesion promoter. It can significantly improve the corrosion resistance of metals (such as steel, copper, aluminum, etc.) and enhance coating adhesion, while also possessing hydrophobicity and weather resistance. With a high vinyl group content in its structure, it is suitable for bonding flexible materials. Compared with monomer silanes, this oligomer forms a more uniform film, has a longer shelf life and higher stability. PCU-K11 (Epoxy Silane Oligomer): Mainly used as an anti-corrosion coating and adhesion promoter. It can significantly improve the corrosion resistance of metals (such as steel, copper, aluminum, etc.) and enhance coating adhesion, while also possessing hydrophobicity and weather resistance. With a high epoxy group content in its structure, it forms stable chemical bonds through ring-opening reaction, making it suitable for meeting the durability requirements of rigid composite materials. Compared with monomer silanes, this oligomer forms a more uniform film, has a longer shelf life and higher stability. PCU-1105 (Silane Oligomer): A high-performance and environmentally friendly passivation treatment agent. It is suitable for the passivation of copper or copper alloys, and can also be used for the passivation of non-ferrous metals such as iron, nickel and chromium.

  ‌“2025 China Electronic Copper Foil Industry Summit Forum”‌ will be held from ‌May 26 to 28, 2025‌ in ‌Nanchang, Jiangxi Province‌! Following the challenges of global supply chain adjustments and technological iterations in 2024, China’s electronic copper foil industry is accelerating its transformation toward a ‌"technology-driven + full-chain collaboration"‌ model. Under the theme ‌"Breakthrough · Momentum · Leap"‌, this forum focuses on ‌optimizing existing capacities, technological innovation, and ecosystem restructuring‌, serving as a critical platform to seize key opportunities in the industry’s transformation. To further advance electronic copper foil technology and promote innovative products, ‌Wuhan Hugarise New Material Co., Ltd.‌ will participate in the ‌“2025 China Electronic Copper Foil Industry Summit Forum”‌ in Nanchang. The forum will gather industry leaders to showcase cutting-edge technological achievements and market trends. During the event, we will highlight a series of newly developed innovative products. These products meet the market’s high-standard requirements through exceptional performance and unique application advantages, as detailed below: ‌‌NEOS‌‌: Direct replacement for protein peptides, stable performance without degradation. ‌‌PCU Series‌‌: Enhances copper oxidation resistance with broad applicability in aqueous systems. ‌‌110 Series‌‌: High-resistance copper foil with ultra-high purity, eliminating edge tearing. Our company is committed to improving product quality and customer experience through technological innovation. Our goal is to continuously develop new products to meet the growing demands of the electronic copper foil industry and provide customers with the highest-quality services and support. We look forward to meeting you in Nanchang to jointly explore the future development of the electronic copper foil industry! Please stay tuned to our official website for more detailed information about our new products and market updates.

‌"The 15th China Electronic Copper Foil Technology Symposium"‌ will be held from ‌November 28 to 30, 2024‌, in ‌Jiaxing City, Zhejiang Province‌. As a dedicated player in electronic chemicals, ‌Wuhan Hugarise New Material Co.,Ltd‌ has been invited once again to participate and collaborate with industry peers in discussing the latest advancements and future trends in electronic copper foil technology. After three years of rapid scale expansion, China's electronic copper foil industry has entered an adjustment phase. Facts demonstrate that mere capacity expansion is not the ultimate path for corporate development; enhancing "soft power" aligns better with current demands. To strengthen connections between copper foil enterprises and upstream/downstream industries, and to establish a new strategic framework focused on terminal demand-driven product upgrades and rapid response to new technological requirements, the ‌Electronic Copper Foil Materials Branch of the China Electronic Materials Industry Association‌ has decided to organize this symposium. The theme of this symposium is ‌"Strengthening Industrial Chain Interconnectivity and Upholding Collaborative Integrated Development"‌. The event will invite experts from national ministries, electronic copper foil industry specialists, and upstream/downstream professionals to deliver insightful reports. Discussions will span macro, meso, and micro levels, addressing ‌new technologies, processes, materials, equipment‌, and future trends in electronic copper foil through extensive and in-depth exchanges. At this symposium, our company is not only an active participant but also an innovator. We have launched ‌three new products‌ tailored for the electronic copper foil sector, aiming to drive industrial advancement through technological innovation and deliver ‌more efficient, environmentally friendly, and high-performance solutions‌ to our clients: ‌Aliphatic Polyoxyethylene Ether Sulfonate (NEOS)‌: This product is an innovative solution inspired by the structural design of hydrolyzed protein peptides. It retains the electrochemical performance of protein peptides while offering superior chemical stability and oxidation resistance, enhancing the mechanical properties of both raw and processed copper foil. It can replace hydrolyzed protein peptides to improve plating brightness, brightening range, and wettability. ‌Water-Soluble Copper Protector (PCU)‌: Soluble in aqueous systems, this product serves as an effective non-ferrous metal protector, particularly excelling in copper corrosion inhibition. It can replace ‌benzotriazole (BTA)‌ and ‌tolyltriazole (TTA)‌, and is suitable for aqueous anti-oxidation systems in various copper and alloy substrates. ‌Sodium Thiazolinyl Dithiopropane Sulfonate (SH110)‌: This product refines grain structure, improves coating leveling, and enhances hardness. It is used in decorative and functional electroplating for hardware copper plating, electroformed copper, printed circuit boards, and lithium battery copper foil. In lithium battery copper foil electroplating processes, it significantly boosts copper foil tensile strength. The ‌15th China Electronic Copper Foil Technology Symposium‌ not only provides a crucial platform for cross-industry communication and collaboration but also marks another leap forward in our company's technological innovation in electronic copper foil. We believe that through continuous R&D and product innovation, we can propel the electronic copper foil industry toward ‌greener and smarter development‌ while contributing to the growth of the electronics sector. Moving forward, ‌Wuhan Hugarise New Material Co.,Ltd will adhere to the principle of ‌"Strengthening Industrial Chain Interconnectivity and Upholding Collaborative Integrated Development"‌, working hand-in-hand with industry peers to achieve new milestones in electronic copper foil technology.