The 2026 China Electronic Copper Foil Industry Summit is in Wuhan, Hubei Province from May 28 to 30, 2026.

 

The electronic copper foil industry maintained a recovery momentum in 2026 with abundant orders and steadily rising processing fees. Multiple growth drivers are at play: the accelerated construction of AI computing power has triggered explosive demand for high-end copper foils such as HVLP for intelligent terminals. Meanwhile, the booming new energy sector, coupled with the impact of recent geopolitical tensions on the global energy system, has created a vital development window for electronic copper foil, an essential basic material.

 

Nevertheless, the industry is confronted with structural overcapacity: low-end production capacity is surplus while high-end capacity remains insufficient. The dividends from capacity expansion are fading, marking an era where technological strength becomes the core competitiveness. Against this backdrop, the 2026 China Electronic Copper Foil Industry Summit is hosted in Wuhan, a transportation hub of central China. Centered on the theme "Address Structural Overcapacity, Realize Independent Operation and Value Co-creation", the summit aims to chart a new course for the industry and drive its transformation from blind low-end expansion to a new ecosystem of value co-creation.

 

During the event, we will showcase our newly developed innovative product portfolio. Featuring outstanding performance and distinctive application strengths, these products fully meet stringent market requirements, as detailed below:

 

 

Mercapto silane oligomer is a type of oligomeric organosilicon compound containing active mercapto groups (-SH) and hydrolyzable siloxane structures. Compared with monomeric silanes, it delivers more uniform film formation, higher stability, greater functionality and superior reactivity. Thanks to its unique chemical structure, it finds wide applications in surface treatment, coatings, environmental protection and other fields. It can inhibit oxidation, corrosion and discoloration of metals; improve the adhesion, weather resistance, abrasion resistance and anti-corrosion performance of coatings; and immobilize heavy metal ions in soil to prevent their migration and diffusion.

 

 

As a methylbenzotriazole derivative soluble in water-based systems, PCU-T serves as an efficient non-ferrous metal corrosion inhibitor, especially for copper. Different from conventional methylbenzotriazole, PCU-T disperses evenly within the film layer without causing surface defects such as oil stains and craters, and exerts no adverse effects on the adhesion and gloss of coatings. It is widely applied in water-based copper-gold paste coatings and metal pipeline water treatment.

 

 

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